In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics
DC Field | Value | Language |
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dc.contributor.author | Hwang, Hyun-Jun | - |
dc.contributor.author | Chung, Wan-Ho | - |
dc.contributor.author | Kim, Hak-Sung | - |
dc.date.accessioned | 2021-08-02T19:26:31Z | - |
dc.date.available | 2021-08-02T19:26:31Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2012-12 | - |
dc.identifier.issn | 0957-4484 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/27427 | - |
dc.description.abstract | In this work, a flash-light sintering process for Cu nanoinks was studied. In order to precisely monitor the milliseconds flash-light sintering process, a real-time Wheatstone bridge electrical circuit and a high-rate data acquisition system were used. The effects of several flash-light irradiation conditions (irradiation energy, pulse number, on-time, and off-time) and the effects of the amount of poly(N-vinylpyrrolidone) in the Cu nanoink on the flash-light sintering process were investigated. The microstructures of the sintered Cu films were analyzed by scanning electron microscopy. To investigate the oxidation or reduction of the oxide-covered copper nanoparticles, a crystal phase analysis using x-ray diffraction was performed. In addition, the sheet resistance of Cu film was measured using a four-point probe method. From this study, it was found that the flash-light sintered Cu nanoink films have a conductivity of 72 Omega m/sq without any damage to the polyimide substrate. Similar nanoinks are expected to be widely used in printed and flexible electronics products in the near future. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Hak-Sung | - |
dc.identifier.doi | 10.1088/0957-4484/23/48/485205 | - |
dc.identifier.scopusid | 2-s2.0-84869063089 | - |
dc.identifier.wosid | 000311138100010 | - |
dc.identifier.bibliographicCitation | NANOTECHNOLOGY, v.23, no.48, pp.1 - 9 | - |
dc.relation.isPartOf | NANOTECHNOLOGY | - |
dc.citation.title | NANOTECHNOLOGY | - |
dc.citation.volume | 23 | - |
dc.citation.number | 48 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 9 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | CONDUCTIVE PATTERNS | - |
dc.subject.keywordPlus | CU | - |
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