Thickness engineering of atomic layer deposited Al₂O₃ films to suppress interfacial reaction and diffusion of Ni/Au gate metal in AlGaN/GaN HEMTs up to 600°C in air
- Authors
- Suria, Ateeq J.; Yalamarthy, Ananth Saran; Heuser, Thomas A.; Bruefach, Alexandra; Chapin, Caitlin A.; So, Hongyun; Senesky, Debbie G.
- Issue Date
- Jun-2017
- Publisher
- AMER INST PHYSICS
- Citation
- APPLIED PHYSICS LETTERS, v.110, no.25, pp.1 - 5
- Indexed
- SCIE
SCOPUS
- Journal Title
- APPLIED PHYSICS LETTERS
- Volume
- 110
- Number
- 25
- Start Page
- 1
- End Page
- 5
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/2751
- DOI
- 10.1063/1.4986910
- ISSN
- 0003-6951
- Abstract
- In this paper, we describe the use of 50nm atomic layer deposited (ALD) Al₂O₃ to suppress the interfacial reaction and inter-diffusion between the gate metal and semiconductor interface, to extend the operation limit up to 600°C in air. Suppression of diffusion is verified through Auger electron spectroscopy (AES) depth profiling and X-ray diffraction (XRD) and is further supported with electrical characterization. An ALD Al₂O₃ thin film (10nm and 50 nm), which functions as a dielectric layer, was inserted between the gate metal (Ni/Au) and heterostructure-based semiconductor material (AlGaN/GaN) to form a metal-insulator-semiconductor high electron mobility transistor (MIS-HEMT). This extended the 50nm ALD Al₂O₃ MIS-HEMT (50-MIS) current-voltage (I-ds-V-ds) and gate leakage (I-g,I-leakage) characteristics up to 600°C. Both, the 10nm ALD Al₂O₃ MIS-HEMT (10-MIS) and HEMT, failed above 350°C, as evidenced by a sudden increase of approximately 50 times and 5.3 x 10⁶ times in I-g,I-leakage, respectively. AES on the HEMT revealed the formation of a Ni-Au alloy and Ni present in the active region. Additionally, XRD showed existence of metal gallides in the HEMT. The 50-MIS enables the operation of AlGaN/GaN based electronics in oxidizing high-temperature environments, by suppressing interfacial reaction and inter-diffusion of the gate metal with the semiconductor.
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