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Cited 16 time in webofscience Cited 16 time in scopus
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Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation

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dc.contributor.authorChang, Seung-Hwan-
dc.contributor.authorKim, Hak-Sung-
dc.date.accessioned2021-08-02T19:51:34Z-
dc.date.available2021-08-02T19:51:34Z-
dc.date.created2021-05-12-
dc.date.issued2011-07-
dc.identifier.issn0032-3861-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/28118-
dc.description.abstractMoisture-induced package failures such as interfacial delamination and pop-corn cracking are common failure phenomena that occur during the solder reflow process in the semiconductor industry. Therefore, the hygroscopic properties of the package materials are crucial factors in the reliability of electronic packaging products. In this work, molecular dynamics (MD) simulation was performed to study the hygroscopic properties, including diffusivity and swelling strain, of epoxy materials with respect to temperature and moisture concentration. Hygroscopic material properties predicted by MD are discussed and compared with the experimental data.-
dc.language영어-
dc.language.isoen-
dc.publisherELSEVIER SCI LTD-
dc.titleInvestigation of hygroscopic properties in electronic packages using molecular dynamics simulation-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Hak-Sung-
dc.identifier.doi10.1016/j.polymer.2011.05.056-
dc.identifier.scopusid2-s2.0-79959826988-
dc.identifier.wosid000292533300024-
dc.identifier.bibliographicCitationPOLYMER, v.52, no.15, pp.3437 - 3442-
dc.relation.isPartOfPOLYMER-
dc.citation.titlePOLYMER-
dc.citation.volume52-
dc.citation.number15-
dc.citation.startPage3437-
dc.citation.endPage3442-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPolymer Science-
dc.relation.journalWebOfScienceCategoryPolymer Science-
dc.subject.keywordPlusMOISTURE DIFFUSION-
dc.subject.keywordPlusSYSTEM-
dc.subject.keywordAuthorHygroscopic characteristic-
dc.subject.keywordAuthorSwelling-
dc.subject.keywordAuthorMolecular dynamics-
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