An electroforming-free mechanism for Cu2O solid-electrolyte-based conductive-bridge random access memory (CBRAM)
DC Field | Value | Language |
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dc.contributor.author | Kwon, Ki-Hyun | - |
dc.contributor.author | Kim, Dong-Won | - |
dc.contributor.author | Kim, Hea-Jee | - |
dc.contributor.author | Jin, Soo-Min | - |
dc.contributor.author | Woo, Dae-Seong | - |
dc.contributor.author | Park, Sang-Hong | - |
dc.contributor.author | Park, Jea Gun | - |
dc.date.accessioned | 2021-07-30T05:05:32Z | - |
dc.date.available | 2021-07-30T05:05:32Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2020-06 | - |
dc.identifier.issn | 2050-7526 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/2838 | - |
dc.description.abstract | In a CuxO solid-electrolyte-based CBRAM cell using an Ag top electrode, electroforming-free and electro-reset processes could be achieved at a specificex situannealing temperature of the solid electrolyte (i.e., 250 degrees C, cubic crystalline); however, below 200 degrees C (i.e., cubic crystalline), no electro-reset process was found and above 300 degrees C (i.e., monoclinic crystalline), an electroforming process was necessary. Theex situannealing temperature of the CuxO solid electrolyte determined the remaining metal (i.e., Cu2+) vacancy concentration of the CuxO solid electrolyte,i.e., a higher annealing temperature led to a lower remaining Cu(2+)vacancy concentration. As a result, a shallower diffusion depth of metal (i.e., Ag) atoms in the CuxO solid electrolyte could be obtained at a higherex situannealing temperature. Since the diffusion depth of Ag atoms decides the shape of the metal (i.e., Ag)-atom filament, the presence of an electroforming or electro-reset process was determined by the precise shape of the Ag-atom filament in the CuxO solid electrolyte,i.e., a shallower diffusion depth of the Ag atoms led to a more inversely conical shape of the Ag-atom filament. The detailed shapes of the Ag-atom filament were simulated by using the diffusion depth profile of metal atoms and the finite element method; in this simulation, a shallower diffusion depth of the Ag atoms led to a more inversely conical shape of the Ag-atom filament. In addition, the shape of the Ag-atom filament was well correlated with the presence of an electroforming or electro-reset process, that is, both electroforming and electro-reset processes were achieved at a moderately inversely conical shape of the metal-atom filament. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ROYAL SOC CHEMISTRY | - |
dc.title | An electroforming-free mechanism for Cu2O solid-electrolyte-based conductive-bridge random access memory (CBRAM) | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jea Gun | - |
dc.identifier.doi | 10.1039/d0tc01325k | - |
dc.identifier.scopusid | 2-s2.0-85088116489 | - |
dc.identifier.wosid | 000542928300013 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS CHEMISTRY C, v.8, no.24, pp.8125 - 8134 | - |
dc.relation.isPartOf | JOURNAL OF MATERIALS CHEMISTRY C | - |
dc.citation.title | JOURNAL OF MATERIALS CHEMISTRY C | - |
dc.citation.volume | 8 | - |
dc.citation.number | 24 | - |
dc.citation.startPage | 8125 | - |
dc.citation.endPage | 8134 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | OXIDE THIN-FILMS | - |
dc.subject.keywordPlus | HIGH-PERFORMANCE | - |
dc.subject.keywordPlus | RERAM | - |
dc.subject.keywordPlus | EVOLUTION | - |
dc.subject.keywordPlus | OXIDATION | - |
dc.subject.keywordPlus | FILAMENT | - |
dc.subject.keywordPlus | LAYER | - |
dc.identifier.url | https://pubs.rsc.org/en/content/articlelanding/2020/TC/D0TC01325K | - |
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