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The Reliability of Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 um Pitch Cu Pillar Bumps and Low-Temperature Curable NonConductive Adhesive (NCA) and Effect of NCA Trapping
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-02T20:26:20Z | - |
| dc.date.available | 2021-08-02T20:26:20Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2018-05-30 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/28555 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers | - |
| dc.title | The Reliability of Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 um Pitch Cu Pillar Bumps and Low-Temperature Curable NonConductive Adhesive (NCA) and Effect of NCA Trapping | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | The 2018 IEEE 68th Electronic Components, and Technology Conference | - |
| dc.relation.isPartOf | The 2018 IEEE 68th Electronic Components, and Technology Conference | - |
| dc.citation.title | The 2018 IEEE 68th Electronic Components, and Technology Conference | - |
| dc.citation.conferencePlace | Sheraton San Diego Hotel & Marina, San Diego, California, USA | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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