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The Reliability of Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 um Pitch Cu Pillar Bumps and Low-Temperature Curable NonConductive Adhesive (NCA) and Effect of NCA Trapping
- Authors
- 김영호
- Issue Date
- 30-May-2018
- Publisher
- Institute of Electrical and Electronics Engineers
- Citation
- The 2018 IEEE 68th Electronic Components, and Technology Conference
- Conference Name
- The 2018 IEEE 68th Electronic Components, and Technology Conference
- Place
- Sheraton San Diego Hotel & Marina, San Diego, California, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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