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Die Warpage Control Applying UBM (Under Bump Metallurgy) on Die Back-Side for FanOut Package Process Applications
- Authors
- 김영호
- Issue Date
- 30-May-2018
- Publisher
- Institute of Electrical and Electronics Engineers
- Citation
- The 2018 IEEE 68th Electronic Components, and Technology Conference
- Conference Name
- The 2018 IEEE 68th Electronic Components, and Technology Conference
- Place
- Sheraton San Diego Hotel & Marina San Diego, California, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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