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Flash light sintering of Cu nano/micro ink for warpage-free Cu electrode with high conductivity by substrate vacuum heating

Authors
김학성
Issue Date
28-Jun-2017
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/31961
Conference Name
International Symposium on Green Manufacturing and Applications (ISGMA 2017)
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서울 공과대학 > 서울 기계공학부 > 2. Conference Papers

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COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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