Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
A new fan-out package structure utilizing the selfalignment effect of molten solder to improve the die shift and enhance the thermal properties
- Authors
- 김영호
- Issue Date
- 1-Jun-2017
- Publisher
- Institute of Electrical and Electronics Engineers
- Citation
- 2017 IEEE 67th Electronic Components and Technology Conference
- Conference Name
- 2017 IEEE 67th Electronic Components and Technology Conference
- Place
- Lake Buena Vista, Florida, USA
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.