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The Low Temperature and Ion Implantation-Based Large-Scale Wafer Bonding for the Monolithic 3D Integration Platform
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 최창환 | - |
| dc.date.accessioned | 2021-08-03T04:26:30Z | - |
| dc.date.available | 2021-08-03T04:26:30Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2017-02-15 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/33717 | - |
| dc.publisher | 한국반도체산업협회/한국반도체협회/대한전자공학회 | - |
| dc.title | The Low Temperature and Ion Implantation-Based Large-Scale Wafer Bonding for the Monolithic 3D Integration Platform | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 최창환 | - |
| dc.identifier.bibliographicCitation | 한국반도체학술대회 | - |
| dc.relation.isPartOf | 한국반도체학술대회 | - |
| dc.citation.title | 한국반도체학술대회 | - |
| dc.citation.conferencePlace | 대명 비발디파크 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)