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Multiphysics Simulation Analysis and Design of Integrated Inverter Power Module for Electric Compressor Used in 48-V Mild Hybrid Vehicles

Authors
Seong, JihwanYoon, Sang WonPark, SeminKim, MinkiLim, JangmukJeon, JaejinHan, Hobeom
Issue Date
Sep-2019
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
48-V mild hybrid vehicles; circuit-level module analysis; direct bonded copper (DBC); electric compressor (e-Compressor); finite-element method (FEM) simulation; motor-inverter integration; multiphysics analysis
Citation
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, v.7, no.3, pp.1668 - 1676
Indexed
SCIE
SCOPUS
Journal Title
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
Volume
7
Number
3
Start Page
1668
End Page
1676
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/3804
DOI
10.1109/JESTPE.2019.2905902
ISSN
2168-6777
Abstract
This paper presents designs, multiphysics finite-element method (FEM) and circuit simulations, and experimental validations of a three-phase inverter power module for an electric compressor (e-Compressor) used in 48-V mild hybrid vehicles. The inverter module is integrated with its motor and scroll. The integration and e-Compressor operation situations raise sequential challenges in the module design and analysis. Thus, the e-Compressor module employs a direct bonded copper (DBC) substrate on which MOSFET dies, shunt resistors, and other electronics are soldered. Multiphysics FEM and circuit simulations are conducted to analyze (and minimize) the parasitic and loop inductances, current concentration, and temperature elevation of the design. The modeling and simulation processes are customized to represent the integrated DBC-based e-Compressor module, including the determination of loop inductance and overshoot voltage by considering systemic current conduction and reasonable simplification of cooling fluid effects. The simulation process and module performances are validated by experiments. The designed e-Compressor inverter module is improved to fully satisfy all the required specifications. Moreover, an excellent agreement between the simulation and the experimental results is confirmed, demonstrating the similar reductions of: 1) loop inductances simulated by FEM (similar to 57%); 2) circuit-simulated overshoot voltages (similar to 47%); and 3) experimentally measured overshoot voltages (similar to 53%).
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