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Adhesion of Thin Metal Films on Polymer Substrates

Authors
김영호
Issue Date
3-Sep-2015
Publisher
Korean-American Scientists and Engineers Association
Citation
17th International Conference on Electronics Materials and Packaging
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/39423
Conference Name
17th International Conference on Electronics Materials and Packaging
Place
Portland, Oregon, USA
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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