Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Non-destructive Technique for Detection of Voids in the IC Package Using Terahertz-Time Domain Spectrometer
- Authors
- 김학성
- Issue Date
- 18-May-2015
- Place
- Paris
- Conference Name
- 17th International Conference on Nondestructive Testing and Evaluation
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)