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Adhesion of Electroless-plated Copper to the Polymer Substrate

Authors
김영호
Issue Date
17-Nov-2014
Publisher
KIM (The Korean Institute of Metals and Materials)
Citation
International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014)
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/41889
Conference Name
International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014)
Place
Jeju Island, Korea
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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