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Development of high stretchable and bendable FPCB materials for the application of flexible electronics
- Authors
- 김영호
- Issue Date
- 23-Oct-2014
- Publisher
- International Microelectronics Assembly and Packaging Society (IMAPS)
- Citation
- 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT)
- Conference Name
- 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT)
- Place
- Taipei, Taiwan
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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