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The microstructure and reliability of solder joints fabricated by using an eco-friendly Cu-xZn wetting layer,
- Authors
- 김영호
- Issue Date
- 7-Aug-2014
- Publisher
- Korean-American Scientists and Engineers
- Citation
- US-Korea Conference (UKC 2014)
- Conference Name
- US-Korea Conference (UKC 2014)
- Place
- San Fransisco, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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