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Thermo-Compression Flipchip Interconnection using Plasma Enhanced Copper Organic Solderability Preservative Etched Substrate
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 정진욱 | - |
| dc.date.accessioned | 2021-08-03T11:17:58Z | - |
| dc.date.available | 2021-08-03T11:17:58Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2013-11-18 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/45756 | - |
| dc.publisher | Institute of Korea Surface Engineering | - |
| dc.title | Thermo-Compression Flipchip Interconnection using Plasma Enhanced Copper Organic Solderability Preservative Etched Substrate | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 정진욱 | - |
| dc.identifier.bibliographicCitation | International Conference on Surface Engineering 2013 | - |
| dc.relation.isPartOf | International Conference on Surface Engineering 2013 | - |
| dc.citation.title | International Conference on Surface Engineering 2013 | - |
| dc.citation.conferencePlace | Busan | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 전기공학전공 > 2. Conference Papers
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Related Researcher
- Chung, Chin Wook
- COLLEGE OF ENGINEERING (MAJOR IN ELECTRICAL ENGINEERING)