극미세피치의 저온 플립칩 접합 기술
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2021-08-03T11:18:38Z | - |
dc.date.available | 2021-08-03T11:18:38Z | - |
dc.date.created | 2021-06-30 | - |
dc.date.issued | 2013-11-14 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/45833 | - |
dc.publisher | 한국마이크로전지 및 패키징학회 | - |
dc.title | 극미세피치의 저온 플립칩 접합 기술 | - |
dc.type | Conference | - |
dc.contributor.affiliatedAuthor | 김영호 | - |
dc.identifier.bibliographicCitation | 패키징학회 정기학술대회 | - |
dc.relation.isPartOf | 패키징학회 정기학술대회 | - |
dc.citation.title | 패키징학회 정기학술대회 | - |
dc.citation.conferencePlace | 서울시립대학교 자연과학관 1층 대회의실 | - |
dc.type.rims | CONF | - |
dc.description.journalClass | 2 | - |
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