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The effect of solder deformation on wetting characteristic on interfacial microstructure of Sn-3.5Ag solder on Cu or Cu substrate
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T14:22:03Z | - |
| dc.date.available | 2021-08-03T14:22:03Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2012-09-17 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/50652 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers | - |
| dc.title | The effect of solder deformation on wetting characteristic on interfacial microstructure of Sn-3.5Ag solder on Cu or Cu substrate | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | international conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.relation.isPartOf | international conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.citation.title | international conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.citation.conferencePlace | Ramada plaza Jeju hotel, Jeju island, Korea | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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