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The effect of solder deformation on wetting characteristic on interfacial microstructure of Sn-3.5Ag solder on Cu or Cu substrate
- Authors
- 김영호
- Issue Date
- 17-Sep-2012
- Publisher
- Institute of Electrical and Electronics Engineers
- Citation
- international conference on Electronic Materials and Nanotechnology for Green Environment
- Conference Name
- international conference on Electronic Materials and Nanotechnology for Green Environment
- Place
- Ramada plaza Jeju hotel, Jeju island, Korea
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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