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A highly reliable Cu-An alloy wetting Layer for Pb-free Solders on advanced materials
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T14:48:57Z | - |
| dc.date.available | 2021-08-03T14:48:57Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2012-06-28 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/51297 | - |
| dc.publisher | KITECH | - |
| dc.title | A highly reliable Cu-An alloy wetting Layer for Pb-free Solders on advanced materials | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | 6th Korean Japan Berkeley Symposium | - |
| dc.relation.isPartOf | 6th Korean Japan Berkeley Symposium | - |
| dc.citation.title | 6th Korean Japan Berkeley Symposium | - |
| dc.citation.conferencePlace | Hearst Mining Building, University of California, Berkeley | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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