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A highly reliable Cu-An alloy wetting Layer for Pb-free Solders on advanced materials

Authors
김영호
Issue Date
28-Jun-2012
Publisher
KITECH
Citation
6th Korean Japan Berkeley Symposium
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/51297
Conference Name
6th Korean Japan Berkeley Symposium
Place
Hearst Mining Building, University of California, Berkeley
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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