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Smart cure cycle to improve tensile load capability of the adhesively bonded joint
- Authors
- 김학성
- Issue Date
- 21-Aug-2011
- Place
- 제주
- Conference Name
- International Conference of Composite Materials 18
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)