Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Smart curing system for a composite laminate using fiber bragg grating sensor and dielectrometry to reduce a thermal residual stress
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2021-08-03T18:18:17Z | - |
| dc.date.available | 2021-08-03T18:18:17Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2011-01-10 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/56221 | - |
| dc.publisher | Laboratory of Applied Mechanics and Reliability Analysis | - |
| dc.title | Smart curing system for a composite laminate using fiber bragg grating sensor and dielectrometry to reduce a thermal residual stress | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김학성 | - |
| dc.identifier.bibliographicCitation | 5th International Conference on Composites Testing and Model Simulation EPFL | - |
| dc.relation.isPartOf | 5th International Conference on Composites Testing and Model Simulation EPFL | - |
| dc.citation.title | 5th International Conference on Composites Testing and Model Simulation EPFL | - |
| dc.citation.conferencePlace | Lausanne, Switzerland | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)