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A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application
- Authors
- 김영호
- Issue Date
- 2-Jun-2010
- Publisher
- IEEE, CPMP
- Citation
- 60th Electronic Components and Technology Conference
- Conference Name
- 60th Electronic Components and Technology Conference
- Place
- Las Vegas, Nevada USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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