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Kinetics of Intermetallic Compound Formation at the Interface between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrate
- Authors
- 김영호
- Issue Date
- 17-Feb-2010
- Publisher
- The Minerals, Metals & Materials Society
- Citation
- TMS 2010
- Conference Name
- TMS 2010
- Place
- Seattle, Washington USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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