Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
A Chip on Flex (COF) Bonding Technique Using Square and Hemispherical Sn bumps
- Authors
- 김영호
- Issue Date
- 15-Apr-2009
- Publisher
- JIEP, IMAPS Japan, IMAPS, IEEE CPMT
- Citation
- ICEP 2009(International Conference on Electronics Packaging)
- Conference Name
- ICEP 2009(International Conference on Electronics Packaging)
- Place
- Kyoto, Japan
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.