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Chip to chip bonding using Cu bumps capped with thin Sn layers
- Authors
- 김영호
- Issue Date
- 19-Feb-2009
- Publisher
- 한국반도체산업협회/한국반도체연구조합
- Citation
- 제 16회 한국반도체학술대회
- Conference Name
- 제 16회 한국반도체학술대회
- Place
- 대전컨벤션센터
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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