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A new Cu-Zn solder wetting layer for Pb- free soldersLee and Young-Ho Kim; Hanyang Univ.

Authors
김영호
Issue Date
10-Sep-2008
Publisher
The Korean Federation of Science & Technology Societies (KOFST) and The Korea-US Science Cooperation
Citation
US-Korea Conference on Science, Technology, and Entrepreneurship
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/63957
Conference Name
US-Korea Conference on Science, Technology, and Entrepreneurship
Place
San Diego, California, US
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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