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분자동역학을 이용한 금속표면의 Kinetic Roughening 현상에 대한 재 증착 효과 연구
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- 정용재
- Issue Date
- 16-Aug-2007
- Place
- 서울 연세대학교
- Conference Name
- 대한금속재료학회 전산재료과학분과 심포지엄
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Chung, Yong Chae
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)