ENEPIG, EPIG, DIrect gold 표면처리와 Cu pillar bump 접합부의 계면반응 연구

김영호

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ENEPIG, EPIG, DIrect gold 표면처리와 Cu pillar bump 접합부의 계면반응 연구

Authors: 김영호

Issue Date: 12-Nov-2020

Publisher: (사)한국마이크로전자 및 패키징 학회

Citation: 강남구 역삼동 한국과학기술회관

URI: https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/6939

Conference Name: 강남구 역삼동 한국과학기술회관

Place: 강남구 역삼동 한국과학기술회관

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Appears in Collections: 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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