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New Fan-Out package structure with Electromagnetic interference shielding effect and moisture ventilation at package level
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-07-30T08:28:59Z | - |
| dc.date.available | 2021-07-30T08:28:59Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2020-11-02 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/7126 | - |
| dc.publisher | The Korean Institute of Metals and Materials | - |
| dc.title | New Fan-Out package structure with Electromagnetic interference shielding effect and moisture ventilation at package level | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | The 6th International Conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.relation.isPartOf | The 6th International Conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.citation.title | The 6th International Conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.citation.conferencePlace | Ramada Plaza Jeju Hotel, Jeju, Korea | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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