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New Fan-Out package structure with Electromagnetic interference shielding effect and moisture ventilation at package level
- Authors
- 김영호
- Issue Date
- 2-Nov-2020
- Publisher
- The Korean Institute of Metals and Materials
- Citation
- The 6th International Conference on Electronic Materials and Nanotechnology for Green Environment
- Conference Name
- The 6th International Conference on Electronic Materials and Nanotechnology for Green Environment
- Place
- Ramada Plaza Jeju Hotel, Jeju, Korea
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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