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Effect of organic particles as abrasives on the surface roughness of silicon wafer surface in final polishing of silicon wafer
- Authors
- 백운규
- Issue Date
- 14-Jun-2005
- Place
- kist
- Conference Name
- International Conference on Electroceramics 2005
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)