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Effect of Agglomerated Secondary Abrasive Size in Nano Ceria Slurry on Oxide and Nitride Films Removal Rate of Pattern Wafer
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백운규 | - |
| dc.date.accessioned | 2021-08-04T04:53:00Z | - |
| dc.date.available | 2021-08-04T04:53:00Z | - |
| dc.date.issued | 2005-04-22 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/72795 | - |
| dc.title | Effect of Agglomerated Secondary Abrasive Size in Nano Ceria Slurry on Oxide and Nitride Films Removal Rate of Pattern Wafer | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국물리학회 | - |
| dc.citation.conferencePlace | 이화여자대학교 | - |
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)