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CMC 첨가에 따른 Wafer Polishing 공정용 콜로이달 실리카 슬러리의 물리화학적 특성이 Wafer Polishing 공정에 미치는 영향
- Authors
- 백운규
- Issue Date
- 15-Oct-2004
- Place
- 군산대학교
- Conference Name
- 2004년 추계 한국세라믹학회
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)