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The effects of water-soluble organic additives on the rheological behavior of colloidal silica slurry and its influence on wafer polishing process
- Authors
- 백운규
- Issue Date
- 4-Jun-2004
- Place
- 성균관대학교
- Conference Name
- International conference on crystal growth and LED Epi and substrate
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)