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Barrier Characteristics of TaN films deposited by remote plasma enhanced atomic layer deposition (PEALD) method using metal Organic Precursor

Authors
전형탁
Issue Date
19-Feb-2004
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/75287
Place
무주리조트 호텔티롤
Conference Name
제11회 한국반도체학술대회
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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