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Cu CMP용 슬러리의 Inhibitor 농도가 Colloidal SiO2 분산안정성 및 Cu CMP 공정에 미치는 영향
- Authors
- 백운규
- Issue Date
- 17-Oct-2003
- Place
- 배재대학교
- Conference Name
- 2003 추계 한국세라믹학회
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)