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Characteristics of Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
- Authors
- 전형탁
- Issue Date
- 20-Aug-2002
- Place
- Hanyang University
- Conference Name
- AVS Topical Conference on Atomic Layer Deposition
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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