Machining characteristics of glass substrates containing chemical components in femtosecond laser helical drilling
- Authors
- Lee, Hyeon-Min; Choi, Jung-Hyun; Moon, Seung-Jae
- Issue Date
- Mar-2021
- Publisher
- KOREAN SOC PRECISION ENG
- Keywords
- Femtosecond laser; Helical drilling; Glass; Glass chemicals
- Citation
- INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY, v.8, no.2, pp.375 - 385
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY
- Volume
- 8
- Number
- 2
- Start Page
- 375
- End Page
- 385
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/7988
- DOI
- 10.1007/s40684-020-00242-2
- ISSN
- 2288-6206
- Abstract
- The machining characteristics of glass substrates containing chemical components were investigated for the purpose of femtosecond laser helical drilling. A femtosecond laser of wavelength 1552 nm and pulse duration 800 fs was adopted in the laser machining system. The substrates investigated were aluminosilicate, soda-lime, and borosilicate glass. The chemical components contained in each glass substrate were quantitatively analyzed by laser ablation-induced chemical plasma mass spectrometry. The characteristics of the drilling conditions for each glass substrate were affected by its chemical components. As the wt% of Al(2)O(3)and MgO components in the glass substrates increased, the ablation threshold energy of each substrate decreased, resulting in greater vertical speed of the laser head.
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