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Dielectric Porperties with Baking Conditions and Anisotropy of Biphenyldianhydriede Phenylenediamine(PGDA-PDA) Polyimide
- Authors
- 신동욱
- Issue Date
- 10-Dec-1999
- Publisher
- Gintic
- Citation
- APACK, Symposium on Advances in Packaging
- Conference Name
- APACK, Symposium on Advances in Packaging
- Place
- Singapore
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- There are no files associated with this item.
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- SHIN, DONG WOOK
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)