Enhancing intense pulsed light sintering characteristic of Cu nanoparticle/microparticle-ink using ultraviolet surface modification on polyimide substrate
DC Field | Value | Language |
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dc.contributor.author | Ryu, Chung-Hyeon | - |
dc.contributor.author | Um, Hui-Jin | - |
dc.contributor.author | Kim, Hak-Sung | - |
dc.date.accessioned | 2021-08-02T09:27:48Z | - |
dc.date.available | 2021-08-02T09:27:48Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2020-05 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/9828 | - |
dc.description.abstract | The effect of ultraviolet (UV) surface modification on a polyimide (PI) substrate was investigated for the intense pulsed light (IPL) sintering of Cu nanoparticle (NP)/microparticle (MP)-ink. The UV surface-modification conditions, such as the wavelength range (UVA, UVB, and UVC) and irradiation intensity, were optimized to enhance the IPL sintering characteristic. To measure the surface roughness of the UV-modified PI substrate, atomic force microscopy was conducted. X-ray photoelectron spectroscopy and contact-angle analysis were performed for measuring the change in the surface functional groups of the PI substrate. The IPL irradiation conditions (pulse power and pulse duration) were optimized to obtain a high electrical conductivity and high adhesion strength. Scanning electron microscopy was performed to analyze the microstructure of the IPL-sintered Cu NP/MP-ink. Laser flash analysis was used to measure the thermal conductivity of the sintered Cu NP/MP-ink on the PI substrate. Additionally, in situ temperature monitoring was conducted to monitor the IPL sintering process in real time. According to the results, the optimal IPL-sintered Cu NP/MP-ink film with UVC modification exhibited a low resistivity of 5.94 mu Omega cm and a high adhesion strength level of 5B. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.title | Enhancing intense pulsed light sintering characteristic of Cu nanoparticle/microparticle-ink using ultraviolet surface modification on polyimide substrate | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Hak-Sung | - |
dc.identifier.doi | 10.1016/j.tsf.2020.137951 | - |
dc.identifier.scopusid | 2-s2.0-85082100874 | - |
dc.identifier.wosid | 000525745900011 | - |
dc.identifier.bibliographicCitation | THIN SOLID FILMS, v.701, pp.1 - 8 | - |
dc.relation.isPartOf | THIN SOLID FILMS | - |
dc.citation.title | THIN SOLID FILMS | - |
dc.citation.volume | 701 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 8 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | SILVER NANOPARTICLES | - |
dc.subject.keywordPlus | FUNCTIONAL-GROUPS | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | PATTERNS | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | POLY(DIMETHYLSILOXANE) | - |
dc.subject.keywordPlus | CONDUCTIVITY | - |
dc.subject.keywordPlus | MECHANISM | - |
dc.subject.keywordPlus | STRENGTH | - |
dc.subject.keywordPlus | OXYGEN | - |
dc.subject.keywordAuthor | Intense pulsed light sintering | - |
dc.subject.keywordAuthor | Ultraviolet surface modification | - |
dc.subject.keywordAuthor | Copper nanoparticle/microparticle ink | - |
dc.subject.keywordAuthor | Hydrophilic group | - |
dc.subject.keywordAuthor | Resistivity | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0040609020301668?via%3Dihub | - |
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