ScholarWorks@Hanyang University

IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal Title

  • IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN

  • E 2156-3985 | P 2156-3950 | 2156-3950 | 2156-3985

Publisher

  • Institute of Electrical and Electronics Engineers Inc.
  • IEEE

Listed on(Coverage)

JCR2011-2019
SJR2012-2019
CiteScore2012-2019
SCI2011-2019
SCIE2011-2021
CC2016-2021
SCOPUS2017-2020

Active

  • Active

    based on the information

    • SCOPUS:2020-10

Country

  • USA

Aime & Scopes

  • IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Homepage

Article List

1 - 6 out of 6 results.

SCIESCOPUS
Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method

Jeon, Eun-Beom; Park, Sung-Hyeon; Yoo, Yun-Sik; Kim, Hak-Sung

ArticleIssue Date2016CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.11, pp.1696 - 1702PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
SCIESCOPUS
Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage

Kim, Do-Hyoung; Joo, Sung-Jun; Kwak, Dong-Ok; Kim, Hak-Sung

ArticleIssue Date2016CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.11, pp.1667 - 1676PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
SCIESCOPUS
Practical Design Guidelines for the Development of High-Precision Roll-to-Roll Slot-Die Coating Equipment and the Process

Seong, Jinwoo; Park, Janghoon; Lee, Jongsu; Ahn, Byoungjoon; Yeom, Joong Hyun; Kim, Jaemin; Hassinen, Tomi; Rhee, Sehun; Ko, Sunglim; Lee, Dongjin, et al.

ArticleIssue Date2016CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.11, pp.1677 - 1686PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
SCIESCOPUS
4-slot, 8-drop impedance-matched bidirectional multidrop DQ bus with a 4.8-Gb/s memory controller transceiverGo to Link

Shin, Woo-Yeol; Hong, Gi-Moon; Lee, Hyongmin; Han, Jaeduk; Park, Kyu-Sang; Lim, Dong-Hyuk; Kim, Sunkwon; Shim, Daeyong; Chun, Jung-Hoon; Jeong, Deog-Kyoon, et al.

ArticleIssue Date2013CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.3, no.5, pp.858 - 869PublisherIEEE
SCIESCOPUS
Equivalent-Circuit Model for High-Capacitance MLCC Based on Transmission-Line TheoryGo to Link

Kim, Myoung-Gyun; Lee, Byoung Hwa; Yun, Tae-Yeoul

ArticleIssue Date2012CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1012 - 1020PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
SCIESCOPUS
Equivalent-Circuit Modeling for Multilayer Capacitors Based on Coupled Transmission-Line TheoryGo to Link

Sun, Hyuk; Jin, Zhe-Jun; Kim, Myoung-Gyun; Park, Chan-Seo; Yun, Tae-Yeoul

ArticleIssue Date2011CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.731 - 741PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
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