Lundh, James Spencer; Song, Yiwen; Chatterjee, Bikramjit; Baca, Albert G.; Kaplar, Robert J.; Armstrong, Andrew M.; Allerman, Andrew A.; Klein, Brianna A.; Kendig, Dustin; Kim, Hyungtak, et al.
ArticleIssue Date2020CitationJOURNAL OF ELECTRONIC PACKAGING, v.142, no.3PublisherASME