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Applying Tersoff-potential and bond-softening models in a molecular dynamics study of femtosecond laser processing

Authors
Lee, Byoung SeoPark, Seungho
Issue Date
28-Jul-2019
Publisher
AMER INST PHYSICS
Citation
JOURNAL OF APPLIED PHYSICS, v.126, no.4
Journal Title
JOURNAL OF APPLIED PHYSICS
Volume
126
Number
4
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/1280
DOI
10.1063/1.5096013
ISSN
0021-8979
Abstract
In the molecular dynamics study of short-pulsed laser processing of semiconductors, potential models capable of describing the atomistic behavior during high electronic excitations is the most critical issue at the current stage. This study of the molecular dynamics adopts the Tersoff-potential model to analyze the ultrafast laser processing of silicon. The model was modified to include electronic excitation effects by reducing the attraction of the antibonding state by half. It offers an excellent description of the experimental behavior during nonthermal melting. Subpicosecond melting is achieved above certain threshold levels of superheating and carrier density as required in experiments. Energy conservation is demonstrated with a bandgap energy of the order obtained in experiments. The modification of the potential mimics an absorption of bandgap energy and a subsequent lattice heating on a time scale within 0.3ps. The melting kinetics establishes a correlation between nonthermal melting and thermal bulk melting. For superheating of less than two, the electronic melting of bond softening proceeds via homogeneous nucleation. The associated thermal theory, corrected with a limit on the nucleus radius to bond length, is still valid for the higher superheating regime. The original Tersoff model shows that this superheating by a factor of two is isothermal for spallation-the lowest-energy ablative mechanism. Its proximity to the evaporating point suggests the role of thermal boiling during spallation.
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