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Effects of ultrasonic process on the adhesion of Cu/non-conductive PCB substrate in electroless copper plating
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kang, Jusuk | - |
| dc.contributor.author | J.-S. | - |
| dc.contributor.author | Lee | - |
| dc.contributor.author | J. | - |
| dc.contributor.author | Kwon | - |
| dc.contributor.author | H.-W. | - |
| dc.contributor.author | Lee, Jae-ho | - |
| dc.contributor.author | J.-H. | - |
| dc.date.available | 2021-03-17T09:42:03Z | - |
| dc.date.created | 2021-02-26 | - |
| dc.date.issued | 2017 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13276 | - |
| dc.title | Effects of ultrasonic process on the adhesion of Cu/non-conductive PCB substrate in electroless copper plating | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Lee, Jae-ho | - |
| dc.identifier.doi | 10.23919/ICEP.2017.7939318 | - |
| dc.identifier.scopusid | 2-s2.0-85021431815 | - |
| dc.identifier.bibliographicCitation | 2017 International Conference on Electronics Packaging, ICEP 2017, pp.30 - 32 | - |
| dc.relation.isPartOf | 2017 International Conference on Electronics Packaging, ICEP 2017 | - |
| dc.citation.title | 2017 International Conference on Electronics Packaging, ICEP 2017 | - |
| dc.citation.startPage | 30 | - |
| dc.citation.endPage | 32 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Conference Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scopus | - |
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)