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Formation of through-silicon-vias by Tin filling processes using pressure infiltration and electrodeposition/reflow
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Donghyun | - |
| dc.contributor.author | D. | - |
| dc.contributor.author | Kim, Jaehwan | - |
| dc.contributor.author | J.-H. | - |
| dc.contributor.author | Oh, Taesung | - |
| dc.contributor.author | T.S. | - |
| dc.date.available | 2021-03-17T09:42:04Z | - |
| dc.date.created | 2021-02-26 | - |
| dc.date.issued | 2017 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13277 | - |
| dc.title | Formation of through-silicon-vias by Tin filling processes using pressure infiltration and electrodeposition/reflow | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Oh, Taesung | - |
| dc.identifier.doi | 10.23919/ICEP.2017.7939317 | - |
| dc.identifier.scopusid | 2-s2.0-85021410501 | - |
| dc.identifier.bibliographicCitation | 2017 International Conference on Electronics Packaging, ICEP 2017, pp.28 - 29 | - |
| dc.relation.isPartOf | 2017 International Conference on Electronics Packaging, ICEP 2017 | - |
| dc.citation.title | 2017 International Conference on Electronics Packaging, ICEP 2017 | - |
| dc.citation.startPage | 28 | - |
| dc.citation.endPage | 29 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Conference Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scopus | - |
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