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Formation of through-silicon-vias by Tin filling processes using pressure infiltration and electrodeposition/reflow
- Authors
- Park, Donghyun; D.; Kim, Jaehwan; J.-H.; Oh, Taesung; T.S.
- Issue Date
- 2017
- Citation
- 2017 International Conference on Electronics Packaging, ICEP 2017, pp.28 - 29
- Journal Title
- 2017 International Conference on Electronics Packaging, ICEP 2017
- Start Page
- 28
- End Page
- 29
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