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Effects of complexing reagents on electroless nicke l-iron alloy plating for diffusion barrier of UBM
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Koo, Ja-kyung | - |
| dc.contributor.author | J.-K. | - |
| dc.contributor.author | Lee, Jae-ho | - |
| dc.contributor.author | J.-H. | - |
| dc.date.available | 2021-03-17T10:45:45Z | - |
| dc.date.created | 2021-02-26 | - |
| dc.date.issued | 2015 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13786 | - |
| dc.title | Effects of complexing reagents on electroless nicke l-iron alloy plating for diffusion barrier of UBM | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Lee, Jae-ho | - |
| dc.identifier.doi | 10.1109/ICEP-IAAC.2015.7111035 | - |
| dc.identifier.scopusid | 2-s2.0-84936152655 | - |
| dc.identifier.bibliographicCitation | ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, pp.300 - 303 | - |
| dc.relation.isPartOf | ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | - |
| dc.citation.title | ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference | - |
| dc.citation.startPage | 300 | - |
| dc.citation.endPage | 303 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Conference Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scopus | - |
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Related Researcher
- Lee, Jae Ho
- Engineering (Advanced Materials)